In the modern electronic manufacturing industry, with the continuous miniaturization and integration of electronic products, the manufacturing accuracy and efficiency of printed circuit boards (PCB) have been challenged unprecedentedly. As the industry's leading automation...
In the modern electronic manufacturing industry, with the continuous miniaturization and integration of electronic products, the manufacturing accuracy and efficiency of printed circuit boards (PCB) have been challenged unprecedentedly. As the industry's leading automation...
In the modern electronic manufacturing industry, with the continuous miniaturization and integration of electronic products, the manufacturing accuracy and efficiency of printed circuit boards (PCBs) have been challenged unprecedentedly. As the industry's leading automation equipment, Panasonic's NPM series placement machines occasionally encounter problems with poor material removal when processing tiny components such as 0201, especially when facing high aspect ratio openings and solder paste filling problems.
High fill printing challenges with high aspect ratio openings
As the size of components on PCBs decreases, the size of the pad openings also decreases accordingly, resulting in a significant increase in the aspect ratio (ratio of opening height to width) of the stencil. This high aspect ratio opening structure makes it extremely difficult to fill solder paste, because solder paste is prone to form bubbles or gaps at the openings when filled under high pressure, and it is difficult to completely remove solder residues during the stripping process, thus affecting welding quality and electrical performance.
Hybrid adsorption function: innovative solution
In response to the above challenges, Panasonic proposed the innovative solution of "hybrid adsorption function". This technology combines multiple adsorption methods and achieves stable grasping and precise placement of tiny components by precisely controlling the adsorption force and adsorption time. In openings with high aspect ratios, the hybrid adsorption function can more effectively overcome the difficulties in solder paste filling and board removal, ensuring accurate component placement and soldering quality.
Optimized design of substrate and stencil: Optima Design Navigator
To further simplify the complexity of high-fill printing, Panasonic has developed the Optima Design Navigator tool. This tool uses advanced algorithms and databases to automatically design the best pad and stencil shapes based on the required solder paste volume. Users can achieve efficient and accurate trial production and evaluation without having to have professional skills or make complex backtracking adjustments. This not only improves production efficiency, but also reduces cost waste caused by design errors.
High-precision and low-load system mounting
Panasonic NPM-DX placement machine excels in high-precision placement. Its ±15µm accuracy and 50µm spacing control capability ensure the precise placement of tiny components. This is due to the combined use of XY axis shock absorption control and placement angle recognition function. Shock absorption control effectively reduces the impact of mechanical vibration on placement accuracy, while the placement angle recognition function can accurately identify the tilt angle of the component and make corresponding adjustments, thereby improving the overall placement quality.
Process Control: APC-MFB2 System
In order to maintain a high level of mounting quality, Panasonic introduced the APC-MFB2 system. The system obtains measurement results from the post-mounting inspection machine (AOI) and feeds them back to the placement machine, enabling real-time monitoring and adjustment of the placement process. This closed-loop control system can detect and correct potential placement errors in a timely manner, thus ensuring that the manufacturing quality of each PCB meets the standards.
In summary, when faced with the challenge of high filling printing with high vertical and horizontal openings, Panasonic NPM series placement machines successfully overcame the problem of poor material collection by introducing a series of innovative solutions such as mixed adsorption function, Optima Design Navigator optimization design tool, high-precision mounting technology and APC-MFB2 process control system, providing strong support for the development of modern electronic manufacturing industry.
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Printers, SPI, SMT machines, AOI, reflow soldering, X-Ray and other complete SMT production line equipment;
SMT peripheral equipment such as loading and unloading machines, docking stations, coating machines, dispensing machines, and material receiving machines;
Feeders, nozzles, boards, valves, belts, spare parts, consumables and other services and solutions.