What are some things to be careful about when chemical plating?
Author: Robby
Aspects of chemical plating that need attention include pre-plating treatment, plating solution selection and control, and safe operation.
Pre-plating treatment: In order to improve the uniformity and brightness of the plated layer, the workpiece needs to be properly pre-treated. This includes removing oil, impurities, etc. from the surface of the workpiece to ensure the quality and performance of the plated layer.
Plating solution selection and control: Selecting the right plating solution is the key, different workpiece materials and requirements require different formulations of plating solution. At the same time, the temperature, PH value, stirring speed and other parameters of the plating solution need to be controlled to ensure the uniformity and denseness of the plating layer. In addition, it is important to avoid violent reactions in the electrolytic cell, such as avoiding excessive air bubbles to avoid porosity and surface roughness of the plated layer.
Safe operation: Since chemical plating is a chemical operation, operators need to pay attention to safety protection, such as wearing protective glasses, gloves and masks, to avoid the plating solution to the body.
Impurity contamination and control: The chemical plating process needs to pay attention to prevent impurity contamination, such as contaminants brought in from pretreatment solution (e.g. degreasing agent, residual oils, etc.) as well as inorganic contaminants (e.g. nitrate) concentration control, in order to avoid affecting the quality and appearance of plating layer.
PH value and temperature control: PH value and temperature have an important influence on the chemical plating process. For example, higher PH and proper temperature can increase the plating rate, but may affect the phosphorus content and thus the abrasion and corrosion resistance of the plated layer.
Loading control: Increasing the loading within a certain range can increase the phosphorus content of nickel plating, but there is no significant decrease in the utilization rate of sodium hypophosphite, which is important for controlling the specific properties of the plated layer.
In summary, the chemical plating process requires attention to a number of aspects, including pre-plating treatment, the selection and control of the plating solution, safe operation, the control of impurity contamination and the appropriate adjustment of PH value, temperature and loading capacity to ensure that high-quality plated layers are obtained.