What is the difference between chemical plating and electroplating?
Author: Robby
1. Chemical plating uses a chemical reaction to produce a thin film on a substrate, while electroplating uses an electric current for electrolytic deposition.
2. The driving force for electroplating is the energy released by the chemical reaction, while the driving force for electroplating comes from the applied current.
3. Chemical plating is often carried out in a solution, and electroplating requires an electrolyzer and electrodes.
4. The reaction conditions of chemical plating are mild, but the precipitation of hydrogen during plating may damage the deposited layer.
5. Chemical plating can be carried out on a non-conductive substrate, electroplating can only be carried out on a conductive substrate.
6. Chemical plating is easy to obtain a homogeneous component layer, electroplating by the local current distribution has a greater impact.
7. Chemical plating equipment is relatively simple, electroplating equipment is more complex, the need for precision control of current parameters.
8. The thickness uniformity of chemical coating layer is slightly worse than electroplating.
9. but chemical plating operation is simple, can be a large area of low-cost deposition.